TG-S4 dual-chamber CVD deposition and PVD magnetron sputtering coater

Detailed Product Description

 

  

  TG-S4 dual-chamber CVD deposition and PVD magnetron sputtering coater

The machine has two vacuum chambers, a CVD deposition for use, another use for PVD magnetron sputtering, the vacuum chamber has a small-scale pre-open box-type structure, two vacuum chamber sizes: diam.400mmX400mm.limited Vacuum: 2X10-4Pa.

Main configurations: CVD chamber heated up to deposition of part of 900 , reaction gas generating device heated up to 300 ± 1 . PVD chamber mounted two RF (or DC) magnetron target (Φ75 or Φ100), substrate heating temperature of 650 , the substrate plate to rotate. The machine can be plating a variety of film (single or multi-layer), including functional membrane. F-250 exhaust system With molecular pump and 2X-30 mechanical pump, two-bedroom share a set of exhaust systems.

The aircraft available be used for education and scientific research for universities, research institutes and factories